Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu +3 more | 2022-05-31 |
| 11328942 | Liquid crystalline elastomer for pick and place of semiconductor devices | Thomas John Farrell Wallin, Yigit Mengue, Ali Sengül, Nicholas Roy Corson, Katherine Healy +5 more | 2022-05-10 |
| 11276672 | Bonding dummy electrodes of light emitting diode chip to substrate | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Ali Sengül | 2022-03-15 |
| 11255529 | Bonding corners of light emitting diode chip to substrate using laser | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Ali Sengül | 2022-02-22 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Jeb Wu +4 more | 2022-02-01 |
| 11234351 | Display fabrication microassembly system | — | 2022-01-25 |
| 11219151 | Pickup head with touch down sensor | — | 2022-01-04 |