Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11349053 | Flexible interconnect using conductive adhesive | Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu +3 more | 2022-05-31 |
| 11342479 | Reducing bowing of materials before wafer-to-wafer bonding for LED manufacturing | William Henry | 2022-05-24 |
| 11302841 | Self-alignment of micro light emitting diode using planarization | Celine Claire Oyer | 2022-04-12 |
| 11302844 | LED surface modification with ultraviolet laser | Vincent Brennan | 2022-04-12 |
| 11296268 | Magnetic clamping interconnects | Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Jeb Wu +2 more | 2022-04-05 |
| 11239400 | Curved pillar interconnects | Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi +4 more | 2022-02-01 |
| 11227970 | Light emitting diodes manufacture and assembly | Celine Claire Oyer | 2022-01-18 |