Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502009 | Die carrier package and method of forming same | Mark E. Henschel | 2022-11-15 |
| 11337625 | Hermetically-sealed package and method of forming same | Jonathan L. Kuhn | 2022-05-24 |
| 11264527 | Integrated circuit package and system using same | Mark E. Henschel | 2022-03-01 |
| 11213690 | Wafer level packages of high voltage units for implantable medical devices | Mohsen Askarinya, Randolph E. Crutchfield, Erik J. Herrmann, Mark S. Ricotta, Lejun Wang | 2022-01-04 |