Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502009 | Die carrier package and method of forming same | Mark R. Boone | 2022-11-15 |
| 11270920 | Integrated circuit package and method of forming same | Chunho Kim | 2022-03-08 |
| 11264527 | Integrated circuit package and system using same | Mark R. Boone | 2022-03-01 |