Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11490811 | Waferscale physiological characteristic sensor package with integrated wireless transmitter | Daniel Hahn, David Probst, Randal C. Schulhauser, Patrick W. Kinzie, Thomas P. Miltich +2 more | 2022-11-08 |
| 11448611 | Structurally reinforced sensor and method for manufacturing the same | Christina Pai, Brian P. McGee, Mary Ellen B. Coe, Cynthia J. Jones, Hsiu-Hsin Chung +3 more | 2022-09-20 |
| 11311215 | Measurement of device materials using non-Faradaic electrochemical impedance spectroscopy | Chi-En Lin, David Probst, Akhil Srinivasan, Melissa Tsang, Michael E. Miller +1 more | 2022-04-26 |
| 11213690 | Wafer level packages of high voltage units for implantable medical devices | Mark R. Boone, Randolph E. Crutchfield, Erik J. Herrmann, Mark S. Ricotta, Lejun Wang | 2022-01-04 |