Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11213690 | Wafer level packages of high voltage units for implantable medical devices | Mark R. Boone, Mohsen Askarinya, Erik J. Herrmann, Mark S. Ricotta, Lejun Wang | 2022-01-04 |