Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Jung-Jin Shim, Hee Yong Shim, Hyun Sung Min, Chang Bo Shim | 2022-12-27 |
| 11497101 | Priority control circuit for operation of vehicle lamps | — | 2022-11-08 |