Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Jung-Jin Shim, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim | 2022-12-27 |
| 11214677 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same | Hee Yong Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2022-01-04 |