Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Hwa Yeon Moon, Jung-Jin Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |
| 11459449 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Hyunsung Min, Young-chan Kim, Changbo SHIM, Gilsang SON | 2022-10-04 |
| 11274218 | Thermosetting resin composition for coating metal thin film and metal laminate using the same | Minhyuk Yun, Young-chan Kim, Hyunsung Min, Changbo SHIM | 2022-03-15 |
| 11214677 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same | Chang Bo Shim, Hyun Sung Min, Young-chan Kim, Seung Hyun Song | 2022-01-04 |