Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535750 | Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same | Jung-Jin Shim, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim | 2022-12-27 |