Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-06-21 |