Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434561 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, Sell Jung, HeeSoo Lee | 2022-09-06 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HeeSoo Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | DeokKyung Yang, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, WoonJae Beak, InSang Yoon | 2022-04-19 |
| 11244908 | Method and device for reducing metal burrs when sawing semiconductor packages | DeokKyung Yang, HeeSoo Lee | 2022-02-08 |