Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-06-21 |
| 11309193 | Semiconductor device and method of forming SIP module over film layer | OhHan Kim, Kyunghwan KIM, HunTeak Lee, InSang Yoon | 2022-04-19 |