Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee, HeeSoo Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | HunTeak Lee, OhHan Kim, HeeSoo Lee, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11244908 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, HeeSoo Lee | 2022-02-08 |