Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417622 | Flip-chip device | John Holmes, Xuefeng Zhang, Dongming He | 2022-08-16 |
| 11380613 | Repurposed seed layer for high frequency noise control and electrostatic discharge connection | Yue Li, Li-Sheng Weng | 2022-07-05 |
| 11321837 | Fiber imaging apparatus, methods, and applications | Shuo Pang, Jian Zhao, Axel Schulzgen | 2022-05-03 |