Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469201 | Semiconductor package and method for fabricating base for semiconductor package | Tzu-Hung Lin, Wen-Sung Hsu, Andrew C. Chang | 2022-10-11 |
| 11450606 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Tzu-Hung Lin, Wen-Sung Hsu | 2022-09-20 |