Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen H. Hall, Emile Davies-Venn, Dong-Ho Han, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen H. Hall, Emile Davies-Venn, Dong-Ho Han, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |