Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328978 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, John J. Beatty | 2022-05-10 |
| 11328979 | Substrate integrated posts and heat spreader customization for enhanced package thermomechanics | Feras Eid, Dinesh Padmanabhan Ramalekshmi Thanu, Johanna M. Swan, John J. Beatty | 2022-05-10 |