Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515273 | Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same | Senaka Kanakamedala, Raghuveer S. Makala | 2022-11-29 |
| 11515250 | Three dimensional semiconductor device containing composite contact via structures and methods of making the same | Monica Titus, Rahul Sharangpani, Senaka Kanakamedala, Raghuveer S. Makala | 2022-11-29 |
| 11482531 | Three-dimensional memory device including multi-bit charge storage elements and methods for forming the same | Jiahui Yuan, Senaka Kanakamedala, Raghuveer S. Makala, Dana Lee | 2022-10-25 |
| 11450687 | Multibit ferroelectric memory cells and methods for forming the same | Roshan Jayakhar TIRUKKONDA, Senaka Kanakamedala, Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar +1 more | 2022-09-20 |
| 11430736 | Semiconductor device including having metal organic framework interlayer dielectric layer between metal lines and methods of forming the same | Raghuveer S. Makala, Senaka Kanakamedala, Yao-Sheng Lee | 2022-08-30 |
| 11393780 | Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same | Senaka Kanakamedala, Raghuveer S. Makala | 2022-07-19 |
| 11387250 | Three-dimensional memory device containing metal-organic framework inter-word line insulating layers | Senaka Kanakamedala, Fei Zhou, Raghuveer S. Makala, Yao-Sheng Lee | 2022-07-12 |
| 11296028 | Semiconductor device containing metal-organic framework inter-line insulator structures and methods of manufacturing the same | Senaka Kanakamedala, Fei Zhou, Raghuveer S. Makala, Yao-Sheng Lee | 2022-04-05 |