SK

Senaka Kanakamedala

ST Sandisk Technologies: 15 patents #8 of 284Top 3%
📍 San Jose, CA: #69 of 6,617 inventorsTop 2%
🗺 California: #556 of 65,961 inventorsTop 1%
Overall (2022): #3,464 of 548,613Top 1%
15
Patents 2022

Issued Patents 2022

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
11515250 Three dimensional semiconductor device containing composite contact via structures and methods of making the same Monica Titus, Ramy Nashed Bassely Said, Rahul Sharangpani, Raghuveer S. Makala 2022-11-29
11515273 Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same Ramy Nashed Bassely Said, Raghuveer S. Makala 2022-11-29
11489043 Three-dimensional memory device employing thinned insulating layers and methods for forming the same James Kai, Johann Alsmeier 2022-11-01
11482531 Three-dimensional memory device including multi-bit charge storage elements and methods for forming the same Ramy Nashed Bassely Said, Jiahui Yuan, Raghuveer S. Makala, Dana Lee 2022-10-25
11469241 Three-dimensional memory device including discrete charge storage elements and methods of forming the same Raghuveer S. Makala, Fei Zhou, Yao-Sheng Lee 2022-10-11
11450687 Multibit ferroelectric memory cells and methods for forming the same Roshan Jayakhar TIRUKKONDA, Ramy Nashed Bassely Said, Rahul Sharangpani, Raghuveer S. Makala, Adarsh Rajashekhar +1 more 2022-09-20
11437270 Three-dimensional memory device containing word lines formed by selective tungsten growth on nucleation controlling surfaces and methods of manufacturing the same Rahul Sharangpani, Raghuveer S. Makala, Fei Zhou, Adarsh Rajashekhar, Fumitaka Amano +1 more 2022-09-06
11430736 Semiconductor device including having metal organic framework interlayer dielectric layer between metal lines and methods of forming the same Ramy Nashed Bassely Said, Raghuveer S. Makala, Yao-Sheng Lee 2022-08-30
11398496 Three-dimensional memory device employing thinned insulating layers and methods for forming the same James Kai, Johann Alsmeier 2022-07-26
11393780 Bonded assembly containing oxidation barriers, hybrid bonding, or air gap, and methods of forming the same Ramy Nashed Bassely Said, Raghuveer S. Makala 2022-07-19
11387250 Three-dimensional memory device containing metal-organic framework inter-word line insulating layers Ramy Nashed Bassely Said, Fei Zhou, Raghuveer S. Makala, Yao-Sheng Lee 2022-07-12
11387244 Three-dimensional memory device including discrete charge storage elements and methods of forming the same Raghuveer S. Makala, Fei Zhou, Yao-Sheng Lee 2022-07-12
11296028 Semiconductor device containing metal-organic framework inter-line insulator structures and methods of manufacturing the same Ramy Nashed Bassely Said, Fei Zhou, Raghuveer S. Makala, Yao-Sheng Lee 2022-04-05
11296101 Three-dimensional memory device including an inter-tier etch stop layer and method of making the same Yao-Sheng Lee, Raghuveer S. Makala, Johann Alsmeier 2022-04-05
11244953 Three-dimensional memory device including molybdenum word lines and metal oxide spacers and method of making the same Raghuveer S. Makala, Yao-Sheng Lee 2022-02-08