Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404318 | Methods of forming through-silicon vias in substrates for advanced packaging | Ying Wang, Guan Huei See, Chang Bum Yong, Arvind Sundarrajan | 2022-08-02 |
| 11373803 | Method of forming a magnetic core on a substrate | Yu Gu, Guan Huei See, Arvind Sundarrajan | 2022-06-28 |