Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410928 | Device layer interconnects | Mark Bohr, Mauro J. Kobrinsky | 2022-08-09 |
| 11373999 | Deep trench via for three-dimensional integrated circuit | Yih Wang, Rishabh Mehandru, Mauro J. Kobrinsky, Tahir Ghani, Mark Bohr | 2022-06-28 |