Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539088 | Ultra-thin microbattery packaging and handling | Bing Dang, Leanna Pancoast, Jae-Woong Nah | 2022-12-27 |
| 11539081 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2022-12-27 |
| 11539080 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, Bing Dang | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Qianwen Chen, Jae-Woong Nah, Bing Dang, Leanna Pancoast | 2022-12-06 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang | 2022-08-23 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, Jeffrey D. Gelorme | 2022-05-31 |
| 11315902 | High bandwidth multichip module | — | 2022-04-26 |
| 11307147 | Accurate colorimetric based test strip reader system | Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan | 2022-04-19 |
| 11268867 | Strain gauge structure for a sensor | Minhua Lu, Katsuyuki Sakuma | 2022-03-08 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more | 2022-01-11 |