Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Bing Dang, John U. Knickerbocker | 2022-05-31 |