Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Jae-Woong Nah +1 more | 2022-01-11 |