| 11539088 |
Ultra-thin microbattery packaging and handling |
Bing Dang, Leanna Pancoast, Jae-Woong Nah |
2022-12-27 |
| 11539081 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2022-12-27 |
| 11539080 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, Bing Dang |
2022-12-27 |
| 11522243 |
Hermetic packaging of a micro-battery device |
Qianwen Chen, Jae-Woong Nah, Bing Dang, Leanna Pancoast |
2022-12-06 |
| 11424152 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang |
2022-08-23 |
| 11411272 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-08-09 |
| 11362382 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, Bing Dang, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-06-14 |
| 11348833 |
IR assisted fan-out wafer level packaging using silicon handler |
Bing Dang, Jeffrey D. Gelorme |
2022-05-31 |
| 11315902 |
High bandwidth multichip module |
— |
2022-04-26 |
| 11307147 |
Accurate colorimetric based test strip reader system |
Minhua Lu, Vince Siu, Russell A. Budd, Evan G. Colgan |
2022-04-19 |
| 11268867 |
Strain gauge structure for a sensor |
Minhua Lu, Katsuyuki Sakuma |
2022-03-08 |
| 11222862 |
High speed handling of ultra-small chips by selective laser bonding and debonding |
Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung +1 more |
2022-01-11 |
