Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11539088 | Ultra-thin microbattery packaging and handling | Leanna Pancoast, Jae-Woong Nah, John U. Knickerbocker | 2022-12-27 |
| 11539081 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2022-12-27 |
| 11539080 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Qianwen Chen, Jae-Woong Nah, Leanna Pancoast, John U. Knickerbocker | 2022-12-06 |
| 11509584 | Routing method, related device, and system | Shihai Hu, Peng Ma | 2022-11-22 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Jeffrey D. Gelorme, John U. Knickerbocker | 2022-05-31 |
| 11342108 | Stackable near-field communications antennas | Bo Wen, Rajeev Narayanan | 2022-05-24 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2022-01-11 |