| 11515289 |
Stacked die integrated with package voltage regulators |
Bharani Chava, Stanley Seungchul Song, Abinash ROY |
2022-11-29 |
| 11485114 |
Electronic device with coating for protection of window |
Sungho AHN |
2022-11-01 |
| 11444068 |
Three-dimensional (3D) integrated circuit device having a backside power delivery network |
Stanley Seungchul Song, Periannan Chidambaram, Pratyush Kamal |
2022-09-13 |
| 11437379 |
Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits |
Stanley Seungchul Song, Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng +6 more |
2022-09-06 |
| 11437367 |
Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter |
Je-Hsiung Lan, Ranadeep Dutta |
2022-09-06 |
| 11417637 |
Stacked decoupling capacitors with integration in a substrate |
Milind Shah, Periannan Chidambaram |
2022-08-16 |
| 11404345 |
Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path |
Je-Hsiung Lan, Ranadeep Dutta |
2022-08-02 |
| 11394360 |
Resonator device |
Je-Hsiung Lan, Ranadeep Dutta |
2022-07-19 |
| 11393789 |
Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding |
Je-Hsiung Lan, Ranadeep Dutta |
2022-07-19 |
| 11380678 |
Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration |
Ranadeep Dutta, Je-Hsiung Lan |
2022-07-05 |
| 11342246 |
Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices |
Aniket PATIL, Hong Bok We |
2022-05-24 |
| 11336251 |
Device with 3D inductor and magnetic core in substrate |
Je-Hsiung Lan, Ranadeep Dutta |
2022-05-17 |
| 11320847 |
Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication |
Ravindra V. Shenoy, Milind Shah, Evgeni Gousev, Periannan Chidambaram |
2022-05-03 |
| 11310911 |
Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure |
Stanley Seungchul Song, Periannan Chidambaram |
2022-04-19 |
| 11296024 |
Nested interconnect structure in concentric arrangement for improved package architecture |
Aniket PATIL, Hong Bok We |
2022-04-05 |
| 11296670 |
Impedance matching transceiver |
Milind Shah, Periannan Chidambaram |
2022-04-05 |
