Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515289 | Stacked die integrated with package voltage regulators | Bharani Chava, Abinash ROY, Jonghae Kim | 2022-11-29 |
| 11502079 | Integrated device comprising a CMOS structure comprising well-less transistors | Hyunwoo Park, Peijie Feng | 2022-11-15 |
| 11444068 | Three-dimensional (3D) integrated circuit device having a backside power delivery network | Jonghae Kim, Periannan Chidambaram, Pratyush Kamal | 2022-09-13 |
| 11437379 | Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits | Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng, Seung H. Kang +6 more | 2022-09-06 |
| 11404374 | Circuits employing a back side-front side connection structure for coupling back side routing to front side routing, and related complementary metal oxide semiconductor (CMOS) circuits and methods | Hyeokjin Lim, Foua Vang, Seung H. Kang | 2022-08-02 |
| 11310911 | Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure | Jonghae Kim, Periannan Chidambaram | 2022-04-19 |
| 11302638 | Hybrid conductor integration in power rail | John Jianhong Zhu, Kern Rim | 2022-04-12 |
| 11270991 | Integrated circuits (ICs) employing front side (FS) back end-of-line (BEOL) (FS-BEOL) input/output (I/O) routing and back side (BS) BEOL (BS-BEOL) power routing for current flow organization, and related methods | Bharani Chava, Mohammed Yousuff Shariff | 2022-03-08 |
| 11257917 | Gate-all-around (GAA) transistors with additional bottom channel for reduced parasitic capacitance and methods of fabrication | Jun Yuan, Peijie Feng, Kern Rim | 2022-02-22 |
| 11244895 | Intertwined well connection and decoupling capacitor layout structure for integrated circuits | Ramesh MANCHANA, Sudheer Chowdary Gali, Biswa Ranjan PANDA, Dhaval Sejpal | 2022-02-08 |