Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11487507 | Multi-bit compute-in-memory (CIM) arrays employing bit cell circuits optimized for accuracy and power efficiency | Ye Lu, Zhongze Wang | 2022-11-01 |
| 11474786 | Fast digital multiply-accumulate (MAC) by fast digital multiplication circuit | Xia Li, Zhongze Wang | 2022-10-18 |
| 11444068 | Three-dimensional (3D) integrated circuit device having a backside power delivery network | Stanley Seungchul Song, Jonghae Kim, Pratyush Kamal | 2022-09-13 |
| 11437379 | Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits | Stanley Seungchul Song, Deepak Sharma, Bharani Chava, Hyeokjin Lim, Peijie Feng +6 more | 2022-09-06 |
| 11417637 | Stacked decoupling capacitors with integration in a substrate | Jonghae Kim, Milind Shah | 2022-08-16 |
| 11340867 | Compute-in-memory (CIM) binary multiplier | Xia Li, Zhongze Wang | 2022-05-24 |
| 11320847 | Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication | Jonghae Kim, Ravindra V. Shenoy, Milind Shah, Evgeni Gousev | 2022-05-03 |
| 11310911 | Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure | Stanley Seungchul Song, Jonghae Kim | 2022-04-19 |
| 11296670 | Impedance matching transceiver | Jonghae Kim, Milind Shah | 2022-04-05 |