Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257560 | Test architecture for die to die interconnect for three dimensional integrated circuits | Sreejit Chakravarty, Puneet Gupta, Wei Ming Lim, Terrence Huat Hin Tan, Amit Sanghani +4 more | 2022-02-22 |