Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11496356 | Device lifecycle management via a central identity service | Alexander Tolpin, Tamer Awad, Timothy James Larden, Rajeev Mandayam Vokkarne, Jelani Z. Brandon +3 more | 2022-11-08 |
| 11257560 | Test architecture for die to die interconnect for three dimensional integrated circuits | Sreejit Chakravarty, Fei Su, Wei Ming Lim, Terrence Huat Hin Tan, Amit Sanghani +4 more | 2022-02-22 |