Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476168 | Die stack override for die testing | Rehan Sheikh, Michael T. Klinglesmith, Sukhbinder Takhar, Shi Hou Chong, Kok Hin Oon +3 more | 2022-10-18 |
| 11257560 | Test architecture for die to die interconnect for three dimensional integrated circuits | Sreejit Chakravarty, Fei Su, Puneet Gupta, Wei Ming Lim, Amit Sanghani +4 more | 2022-02-22 |