Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462583 | Embedding magneto-resistive random-access memory devices between metal levels | Ashim Dutta, Chih-Chao Yang, John C. Arnold, Theodorus E. Standaert | 2022-10-04 |
| 11302630 | Electrode-via structure | Theodorus E. Standaert, Chih-Chao Yang | 2022-04-12 |
| 11232983 | Copper interconnect structure with manganese barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2022-01-25 |
| 11222817 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2022-01-11 |
| 11217742 | Bottom electrode for semiconductor memory device | Chih-Chao Yang, Theodorus E. Standaert | 2022-01-04 |