Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Li-Hsuan Shen +3 more | 2022-12-06 |
| 11407156 | Molding system for preparing an injection-molded article | Huan-Chang Tseng, Rong-Yeu Chang | 2022-08-09 |
| 11376777 | Molding system for preparing molded article with orientation effect | Huan-Chang Tseng, Rong-Yeu Chang | 2022-07-05 |
| 11376776 | Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same | Chen Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Rong-Yeu Chang | 2022-07-05 |
| 11378505 | Method of measuring extensional viscosity of polymer melts and capillary injection system | Huan-Chang Tseng, Rong-Yeu Chang | 2022-07-05 |
| 11355435 | Semiconductor device with air gaps | — | 2022-06-07 |
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang | 2022-06-07 |
| 11309313 | Semiconductor device with landing pad of conductive polymer and method for fabricating the same | — | 2022-04-19 |
| 11230044 | Method of setting pressure profile of injection-molding apparatus | Rong-Yeu Chang, Yuing Chang, Ting-Yu Cheng | 2022-01-25 |
| 11230043 | Method for setting molding conditions of injection-molding equipment | Rong-Yeu Chang, Chuan-Wei Chang | 2022-01-25 |
| 11225005 | System for setting molding conditions of injection-molding equipment | Rong-Yeu Chang, Chuan-Wei Chang | 2022-01-18 |