Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Li-Hsuan Shen +3 more | 2022-12-06 |
| 11407156 | Molding system for preparing an injection-molded article | Huan-Chang Tseng, Chia-Hsiang Hsu | 2022-08-09 |
| 11376776 | Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same | Chen Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Chia-Hsiang Hsu | 2022-07-05 |
| 11376777 | Molding system for preparing molded article with orientation effect | Huan-Chang Tseng, Chia-Hsiang Hsu | 2022-07-05 |
| 11378505 | Method of measuring extensional viscosity of polymer melts and capillary injection system | Huan-Chang Tseng, Chia-Hsiang Hsu | 2022-07-05 |
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Chia-Hsiang Hsu | 2022-06-07 |
| 11230044 | Method of setting pressure profile of injection-molding apparatus | Yuing Chang, Chia-Hsiang Hsu, Ting-Yu Cheng | 2022-01-25 |
| 11230043 | Method for setting molding conditions of injection-molding equipment | Chia-Hsiang Hsu, Chuan-Wei Chang | 2022-01-25 |
| 11225005 | System for setting molding conditions of injection-molding equipment | Chia-Hsiang Hsu, Chuan-Wei Chang | 2022-01-18 |