Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Li-Hsuan Shen +3 more | 2022-12-06 |
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Yu-En Liang, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu | 2022-06-07 |