| 11521903 |
Method of measuring voids in underfill package |
Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Li-Hsuan Shen +3 more |
2022-12-06 |
| 11407156 |
Molding system for preparing an injection-molded article |
Huan-Chang Tseng, Rong-Yeu Chang |
2022-08-09 |
| 11376777 |
Molding system for preparing molded article with orientation effect |
Huan-Chang Tseng, Rong-Yeu Chang |
2022-07-05 |
| 11376776 |
Method of measuring true shear viscosity profile of molding material in capillary and molding system performing the same |
Chen Wang, Yu-Ho Wen, Guo-Sian Cyue, Chih-Chung Hsu, Rong-Yeu Chang |
2022-07-05 |
| 11378505 |
Method of measuring extensional viscosity of polymer melts and capillary injection system |
Huan-Chang Tseng, Rong-Yeu Chang |
2022-07-05 |
| 11355435 |
Semiconductor device with air gaps |
— |
2022-06-07 |
| 11355361 |
Method of measuring underfill profile of underfill cavity having solder bumps |
Yu-En Liang, Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang |
2022-06-07 |
| 11309313 |
Semiconductor device with landing pad of conductive polymer and method for fabricating the same |
— |
2022-04-19 |
| 11230044 |
Method of setting pressure profile of injection-molding apparatus |
Rong-Yeu Chang, Yuing Chang, Ting-Yu Cheng |
2022-01-25 |
| 11230043 |
Method for setting molding conditions of injection-molding equipment |
Rong-Yeu Chang, Chuan-Wei Chang |
2022-01-25 |
| 11225005 |
System for setting molding conditions of injection-molding equipment |
Rong-Yeu Chang, Chuan-Wei Chang |
2022-01-18 |