Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu | 2022-06-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355361 | Method of measuring underfill profile of underfill cavity having solder bumps | Chia-Peng Sun, Chih-Chung Hsu, Rong-Yeu Chang, Chia-Hsiang Hsu | 2022-06-07 |