Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302653 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo | 2022-04-12 |
| 11276658 | Devices with three-dimensional structures and support elements to increase adhesion to substrates | Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen | 2022-03-15 |