Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Howe Yin Loo, Sujit Sharan, Tin Poay Chuah | 2022-06-07 |
| 11264338 | Integrated circuit package with through void guard trace | Krishna Srinivasan, Arnab Sarkar | 2022-03-01 |