Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11533024 | Multi-zone radio frequency transistor amplifiers | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2022-12-20 |
| 11488923 | High reliability semiconductor devices and methods of fabricating the same | Sung Chul Joo, Brian Condie, Benjamin P. Law, Jae Hyung Park | 2022-11-01 |
| 11437362 | Multi-cavity package having single metal flange | Saurabh Goel, Cynthia Blair, Cristian Gozzi | 2022-09-06 |
| 11430744 | Die-attach method to compensate for thermal expansion | David Seebacher, Christian Schuberth, Peter Singerl | 2022-08-30 |
| 11424177 | Integrated circuit having die attach materials with channels and process of implementing the same | Mitch Flowers, Erwin B. Cohen | 2022-08-23 |
| 11367696 | Radio frequency amplifiers having improved shunt matching circuits | Simon Ward, Richard Wilson | 2022-06-21 |
| 11356070 | RF amplifiers having shielded transmission line structures | Kwangmo Chris Lim, Basim Noori, Qianli Mu, Marvin Marbell, Scott Sheppard | 2022-06-07 |
| 11289378 | Methods for dicing semiconductor wafers and semiconductor devices made by the methods | Kevin Shawne Schneider | 2022-03-29 |
| 11257740 | Device carrier configured for interconnects, a package implementing a device carrier having interconnects, and processes of making the same | Simon Ward, Madhu Chidurala | 2022-02-22 |