Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309269 | Method for producing a solder bump on a substrate surface | Arnaud Garnier, Laetitia Castagne, Anthony De Luca, Pierre Montmeat | 2022-04-19 |
DM
Daniel Mermin
Overall (2022): #481,106 of 548,613Top 90%
1
Patents 2022