Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408061 | High temperature, creep-resistant aluminum alloy microalloyed with manganese, molybdenum and tungsten | David N. Seidman, David C. Dunand, James Maurice Boileau, Bita Ghaffari | 2022-08-09 |
| 11309269 | Method for producing a solder bump on a substrate surface | Arnaud Garnier, Laetitia Castagne, Daniel Mermin, Pierre Montmeat | 2022-04-19 |