Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309269 | Method for producing a solder bump on a substrate surface | Laetitia Castagne, Anthony De Luca, Daniel Mermin, Pierre Montmeat | 2022-04-19 |
AG
Arnaud Garnier
Overall (2022): #524,686 of 548,613Top 100%
1
Patents 2022