Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335584 | Method of dismantling a stack of at least three substrates | Thierry Enot, Frank Fournel | 2022-05-17 |
| 11309269 | Method for producing a solder bump on a substrate surface | Arnaud Garnier, Laetitia Castagne, Anthony De Luca, Daniel Mermin | 2022-04-19 |
| 11244971 | Method of transferring a thin film from a substrate to a flexible support | Laurent Michaud, Clement Castan, Frank Fournel | 2022-02-08 |