Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430814 | Metallization structures for stacked device connectivity and their methods of fabrication | Aaron D. Lilak, Anh Phan, Patrick Morrow, Willy Rachmady, Gilbert Dewey +6 more | 2022-08-30 |
| 11417567 | Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom | Florian Gstrein, Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus +2 more | 2022-08-16 |