Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more | 2022-07-12 |