Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2022-10-04 |
| 11288429 | Electrical mask validation | Derren N. Dunn, Michael A. Guillorn, Shawn P. Fetterolf | 2022-03-29 |