Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya +3 more | 2022-12-13 |
| 11340258 | Probe pins with etched tips for electrical die test | Joseph D. Stanford, Todd P. Albertson, Mohit Mamodia, Dingying Xu | 2022-05-24 |